Intern, Engineering
at Western Digital

Summary

Join Western Digital to lead research, surveys, benchmarking, and innovation in advance packaging technologies.

Requirements

• Minimum Bachelor’s degree in Semiconductor science / Material / Electronic or equivalent
• Skillful at English communication, on writing & speaking
• Good communication skill

Responsibilities

• Lead research, surveys, benchmarking, and innovation in advance packaging technologies
• Conduct prototyping and feasibility assessments for new technologies and platforms
• Integrate emerging technologies and platforms into package design and processes to validate functionality