Senior Manager, Hardware Development Engineering

Summary

Join Western Digital's Chemical Mechanical Planarization (CMP) Process Development team as an Engineering Manager. Lead a team of engineers and technicians in developing new CMP processes and technologies. Guide the team on short-term and long-term projects to meet new product launch requirements. Supervise the development and evaluation of new CMP processing technologies and methodologies. Collaborate with cross-functional teams on design integration and issue resolution. Troubleshoot development line issues, conduct root cause analyses, and implement corrective actions. Transfer new processes to manufacturing engineering and support implementation and ramping. This role requires a PhD in a related field and at least 5 years of CMP process development experience.

Requirements

• PhD degree in physics, chemistry, chemical engineering, materials science, or a related engineering field
• At least 5 year of knowledge / working experience on CMP process development, and post cleaning processes
• Understanding other process techniques, such as photolithography, dry or wet etching, electroplating, or thin film deposition processes
• Excellent communication skills, both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations
• Demonstrated leadership and project driving skills, capable of managing team and projects with set milestones and timeline, and ability to execute

Responsibilities

• Lead a group of talented process development engineers and technicians responsible for CMP new process development
• Guide and prioritize CMP development team on long term and short term projects, to meet new product launch requirement and schedule
• Supervise team to develop or evaluate new CMP processing technology, methodology, consumables or advance tooling to meet new product needs and manufacturability
• Work with cross functional teams including design, integration, and other development process modules on designs incorporating CMP or resolving any integration issue
• Guide team on trouble-shoot the related issues in development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions
• Be responsible for team on new process to manufacturing engineering (ME) transferring, support ME team on necessary process implementing and manufacturing ramping

Preferred Qualifications

• Experience with statistical analysis tools, such as JMP, is a plus
• Experience in wafer-level magnetic recording head fabrication and integration are desirable

Benefits

• Paid vacation time
• Paid sick leave
• Medical/dental/vision insurance
• Life, accident and disability insurance
• Tax-advantaged flexible spending and health savings accounts
• Employee assistance program
• Other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
• Tuition reimbursement
• Transit
• The Applause Program
• Employee stock purchase plan
• The Western Digital Savings 401(k) Plan
• You will be eligible to participate in Western Digital’s Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance
• Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan
• RSU awards are also available to eligible new hires, subject to Western Digital’s Standard Terms and Conditions for Restricted Stock Unit Awards