Asic Package Engineer

Summary

Join our team as an experienced ASIC Packaging Engineer specializing in Signal Integrity (SI) and Power Integrity (PI)! You will play a crucial role in the development of custom ASICs, driving chip-package-system co-design and optimizing signal and power integrity requirements. Responsibilities include defining power tree structures, running simulations, developing validation methodologies, and collaborating with cross-functional teams. This role requires a Bachelor's or Master's degree in a relevant field and 5+ years of experience in SI/PI simulation and validation. Proficiency with various simulation tools and high-speed interface protocols is essential. Experience with consumer hardware design and computational electromagnetics is also needed.

Requirements

• Bachelor or Master degree in Electrical Engineering, Physics, Mathematics, or related field (or equivalent experience)
• 5+ years of experience in SIPI simulation and validation areas
• Experience with high-speed interface protocols such as MIPI, PCIe, memory, HBM and USB
• Experience using Cadence Sigrity, PowerSI, Ansys SIwave, Keysight ADS, 3D layout and Ansys HFSS
• Experience with consumer hardware design, review and bring-up process, CAD tools, constraint manager etc
• Solid understanding and experience in computational electromagnetics and transmission line theory

Responsibilities

• Drive chip-package-system co-design by driving signal and power integrity requirements analysis and optimization
• Define power tree structure, netlists, etc for High Performance Computing based on 2.5D/3D package technology
• Run pre-layout and post-layout simulation flow with a focus on high-speed interface and PDN, create simulation models and develop simulation methodology for SIPI
• Develop SIPI validation methodology and develop detailed engineering test plans
• Validate high speed interface and PDN impedance in lab to correlate simulation results and improve design flow
• Work closely with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams to design and ensure package/system SI/PI performance meets expectation before Gerber out, also work closely with Design Validation teams to support SI/PI failure analysis
• Package/Board power delivery network AC+DC simulation for low-voltage/high-current supplies
• Development of next generation memory interface considering Input/Output Physical Layer (IO PHY), SI/PI and physical design