InnoPhase IoT is hiring a
IC Packaging Engineer

Summary

Join a team of brilliant people at Innophase IoT, where you can work on innovative low power wireless devices and experience different aspects of work. We're looking for someone who is good at what they do, but wants to be the best at what they do.

Requirements

• Experience in semiconductor packaging field
• Must have worked on several packaging types such as QFN, BGA, CSP from concept to HVM
• Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
• Ability to work independently and orchestrate projects with minimum supervision
• Experience in tools such as Allegro Package Designer, Virtuoso etc
• Experience in SIP, module designs
• BSEE with 15+ years
• MSEE with 10+ years

Responsibilities

• Design, develop package for InnoPhase IoT's innovative low power wireless devices
• Collaborate with multi-functional teams to understand packaging requirements
• Work with foundry and OSAT to bring packaging solution from concept to HVM
• Package design, architecture, implementation, simulation and post silicon testing